05.12.2022
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Munich, December 05, 2022 – At this year’s Electronica trade fair in Munich, ASMPT exhibited for the first time under its consolidated brand in Europe as the company’s Semiconductor Solutions (SEMI) unit once again demonstrated its market-leading position in the area of mainstream and advanced equipment for semiconductor assembly and packaging with great success. The audience saw wire and die bonder systems paired with real-time monitoring technology, all of which are unique in terms of performance, precision, flexibility, and investment protection.
“We are ONE company” is the result of a global rebranding in August 2022, as a result of which all units now operate under the uniform ASMPT brand. With our leading semiconductor and SMT solutions, we are the “one-stop shop” of choice especially for the automotive industry. The customer benefits are obvious: increased synergy effects, more resources, more direct lines of contact, and more agility,” explains David Felicetti, Head of Business Development EMEA. “The Electronics trade fair was the perfect platform for ASMPT to convey these advantages to the large number of visitors in an impressive manner.” The main focus at the ASMPT booth was on bonding. The AMICRA NANO features a placement accuracy of ±0.2 μm at 3 σ for all types of die-attach and flip-chip applications. The Eagle AERO opens up new dimensions for high-end IC applications with a speed advantage of up to 30 percent (up to 24 2-millimeter connections per second), a precision of 2.0 μm at 3 σ, and a ball size that can be as small as 22 μm. The AEROEYE real-time monitoring technology checks all relevant parameters for the Eagle AERO, thus ensuring early fault detection and optimum performance. AEROEYE is the first step towards SkyEye, ASMPT Semiconductor Solutions’ approach to fully AIoT-supported production.
“The machines with their industry-leading performance accounted for only a small part of our Electronica presentation. Many of the visitors took advantage of the opportunity to talk directly with the many ASMPT experts at the booth and to discuss their particular problems and requirements on site,” says David Felicetti. “We were thus able to impressively demonstrate that our portfolio comprises much more than bonding. ASMPT SEMI offers an unrivaled portfolio of solutions ranging from film deposition to bonding, molding and trim-and-form to the integration of machines into complete inline systems for microelectronics, semiconductor, photonics, optoelectronics, and end applications.”
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