ASMPT Semiconductor Solutions
Back
Back
  • Products
  • Advanced Packaging
  • IC & Discrete
  • CMOS Image Sensor In-line Solution
  • LED / Photonics
Back
Back
Back
Back
Back
Back
Back
Back
Back
Back
Back
Back
Back
Back
Back
Back
Back
Back
Back
Back
Back
Back
Back
Back
Back

Products

For processes like LED and CIS production, wafer and panel level packaging, system-in-package, smartcards, RFID, MEMS, discrete IC and power electronics, ASMPT has developed complete solutions that map these processes in their entirety.

IC & Discrete

  • Clip Bonding
  • Die Bonding
  • Silver Sintering
  • Wire Bonding
  • Metrology
  • Automated Optical Inspection (AOI)
  • Encapsulation
  • Singulation, Trim & Form
  • Inspection, Test & Packing

Learn more about our IC & Discrete Processes

CMOS Image Sensor

  • Inline Solution
  • Die Bonding
  • Snap Curing
  • Wire Bonding
  • Automated Optical Inspection (AOI)
  • Cleaning (DI-Water / Plasma)
  • Lens Attach
  • Active Alignment
  • Test & Calibration

Learn more about our CMOS Image Sensor Assembly Processes

LED / Photonics

  • FOL
  • Die Bonding
  • Transfer & Bonding
  • Wire Bonding
  • Lens Attach
  • Package Inspection
  • Automation

Learn more about our LED / Photonics Processes

Corporate Information
Products
Solutions
Social Media
© ASMPT 2024 | Legal notice

Choose your preferred language

English | Deutsch | 日本語 | 简体中文 | 繁體中文