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Wafer Sputtering - Apollo 200

Apollo 200 has the flexibility to sputter thin or thick metal film using trays to protect fragile wafers. This sputtering tool deposits films increase the overall thermal rating of a package, as well as provide low resistance connectivity. More information

Applications
  • Configurable for up to 5 metals
  • SiC / Power Devices
  • UBM/RDL
  • RF Filters
  • EMI
Features
  • Multiple wafer size capability
  • Size Change
  • Degas/anneal
  • ICP/CCP Etch (Optimal Reactive Plasma Treatment)
Substrates
  • 100, 150, and 200 mm wafers
  • Fragile & thin wafer processing
  • Silicon, EMC, Glass, LiNbO3/LiTaO3, GaAs, Bonded

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