Back Side Die Metallization - High throughput sputtering solution for thick and thin films and multiple wafer sizes.
Multi-beam Laser Dicing of SiC Wafers
New Generation of 12” Automatic Die Bonder
Automatic Soft Solder Die Bonder
Automatic Clip Bonding System
Automatic Eutectic Die Bonding System
Heavy Aluminum Wire Bonding System
Automated Optical Inspection Machine
Transfer Molding System Meeting All Package Demand
Automatic Trim & Form System
Automatic Turret-Based Test & Finish Handler
Placement of Passive Components and Bare Dies from Tape
ASMPT NEXX offers sputtering and plating wafer level and plating panel level solutions dedicated to the processes that support power device manufacturing. NEXX serves both the high volume and research and development needs of power devices makers.
ASMPT ALSI is the inventor of Multi-Beam laser dicing and grooving. Application examples on IGBT, MOSFET, SiC & GaN, Transistors & Diodes
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